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Electronics & Avionics

Subject Matter Expert Electronics Design and Analysis Engineer – Electronic Packaging Design

Boeing

Lead electronic packaging and mechanical product-design activities for advanced aerospace and space electronics within Boeing’s Electronic Products organisation.

Boeing logo

Location

El Segundo, California, United States

Work mode

On-site

Employment

Full-time

Experience

Lead

Visa support

No Visa Sponsorship

Salary

$1,46,200 – $1,97,800 per year

Official Boeing Level 4 summary pay range. Actual compensation depends on experience, qualifications and market considerations.

Application deadline: 1 September 2026

Opportunity

Job Description

Boeing Space, Intelligence & Weapons Systems is seeking a subject-matter expert to join its Electronics Packaging and Product Design team. The engineer will develop packaging solutions that protect and support high-performance electronics used in demanding aerospace environments.

The position combines electronic-product design, mechanical packaging, thermal and structural considerations, producibility and lifecycle support. The engineer will guide complex technical decisions and collaborate with electrical, mechanical, manufacturing and programme teams.

Responsibilities

• Lead electronic packaging and aerospace-product design activities.
• Develop mechanical designs for electronic assemblies, modules and enclosures.
• Evaluate thermal, structural, environmental and producibility requirements.
• Produce and review technical drawings, models and design documentation.
• Guide component selection, material selection and packaging architecture.
• Resolve complex product-design and integration problems.
• Mentor engineers and provide subject-matter expertise across programmes.

Eligibility

• Bachelor’s degree or equivalent qualification is required.
• Must satisfy United States export-control requirements as a U.S. Person.
• Must be able to obtain a United States security clearance.
• U.S. citizenship is required for the security-clearance process.
• Must possess substantial relevant engineering and electronic-packaging experience.

Required Skills

Electronic packaging designMechanical product designAerospace electronicsEngineering drawingsDesign integration

Preferred Skills

Spacecraft electronic hardwareThermal analysisStructural analysisTechnical leadership

Application Instructions

Apply through Boeing’s official careers page and include evidence of electronic packaging, aerospace-product design and technical-leadership experience.

Apply through UCO Aero

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