Opportunity
Job Description
This senior engineering position provides technical leadership for the materials, fabrication and assembly processes used in aerospace electronic hardware. The engineer supports printed circuit boards, printed wiring assemblies, circuit-card assemblies, interconnect packaging and high-reliability electronic materials used in spacecraft, missiles, naval systems and military and commercial aircraft.
Responsibilities
• Define materials and process requirements for electronic hardware.
• Evaluate printed circuit board and circuit-card assembly designs.
• Ensure compliance with IPC and aerospace electronic-material standards.
• Investigate material, fabrication and assembly failures.
• Qualify suppliers, manufacturing methods and material systems.
• Develop process specifications and technical documentation.
• Lead technical reviews and recommend corrective actions.
• Provide guidance across engineering, quality and manufacturing teams.
Eligibility
• Advanced technical education in engineering, physics, chemistry, mathematics or a related discipline.
• Approximately fourteen or more years of relevant experience for Level 5.
• At least fifteen years of printed circuit board, assembly or electronic-packaging experience.
• Knowledge of printed wiring boards and circuit-card assemblies.
• Experience with high-reliability aerospace electronic-material requirements.
Required Skills
Preferred Skills
Application Instructions
Open Boeing’s official page, select APPLY NOW and complete the application for Job ID JR2026517584.
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